Bonding Dies & Pattern Rings

Less Build-up and Breakage



Through advancement in materials and process, TSI has enhanced the performance of various embossing & bonding dies.  Combined with the latest technologies in both EDM processes TSI in conjunction with our partner companies has reduced the buildup and improved tool life.  Providing the latest technology in material selection is an additional benefit built into our tooling.

We would like to show you what a difference quality tooling can make in your application. 

Contact us for additional information or to discuss the details.